Microstructural characteristics and thermal expansion coefficient of AIN-Cu nanocomposite materials prepared by solid state processing

Lee, K.-M.K.-M.LeeSung, J.J.SungLee, S.-I.S.-I.LeeKim, J.-S.J.-S.KimWeißgärber, T.T.WeißgärberKieback, B.B.Kieback2022-03-032022-03-032001https://publica.fraunhofer.de/handle/publica/199234en620660671Microstructural characteristics and thermal expansion coefficient of AIN-Cu nanocomposite materials prepared by solid state processingjournal article