Haapalinna, AtteAtteHaapalinnaNevas, SauliusSauliusNevasPahler, DietmarDietmarPahler2022-03-032022-03-032004https://publica.fraunhofer.de/handle/publica/20562410.1016/j.mseb.2003.12.008en670658620Rotational grinding of silicon wafers-sub-surface damage inspectionjournal article