Albrecht, OliverOliverAlbrechtMüller, MaikMaikMüllerPetersen, LukasLukasPetersenNowotnik, LucaLucaNowotnikPanchenko, JulianaJulianaPanchenko2025-02-252025-02-252024https://publica.fraunhofer.de/handle/publica/48422210.1109/ESTC60143.2024.10712075In recent years there has been an increased need for high-temperature-resistant electronics both in power electronics and in robust sensor systems for industrial applications. This is often linked to the development of new materials and technologies. However, there are a number of applications where the use of SMT or THT-compatible components and interconnect technologies is an alternative for both cost reasons and the load scenario. This paper presents reliability studies for the manufacturing of high-temperature-resistant electronics in SMT assembly based on commercial components for the isothermal load case of 200°C. The evaluation criteria include both the electrical properties and the consideration of the shear strengths with the associated fracture patterns.enconference paper