Azdasht, G.G.AzdashtKasulke, P.P.KasulkeBadrihafifekr, H.H.BadrihafifekrWeiss, S.S.WeissZakel, E.E.Zakel2022-03-082022-03-082002https://publica.fraunhofer.de/handle/publica/305295The components are of materials of different expansion coeffts., and at least one component is an electric power element. High melting material are used for connection structure, forming individual connection elements (29) between the contact faces (27,28) of the component elements (21,22). Preferably each connection element is made of a single material and directly coupled to the contact faces. Typically as a laminated structure. The connection elements may contain an intermediate layer of a soldering material for contacting the opposite contact faces. USE/ADVANTAGE - For electronic power elements, such as laser diodes etc. Reliable reduction of thermally induced stresses without impairing the component service life.de608621patent1996-19646476