Temperature Challenges for Integrated Systems due to High Power Density

Under CopyrightSchletz, A.A.SchletzBayer, C.F.C.F.BayerHutzler, A.A.Hutzler2022-03-1416.10.20202020https://publica.fraunhofer.de/handle/publica/40903410.24406/publica-fhg-409034enpower semiconductorsDC-link capacitorelectrical insulationdie attachhigh temperature670620530Temperature Challenges for Integrated Systems due to High Power Densitypresentation