3D simulation of the conformality of copper layers deposited by low-pressure chemical vapor deposition from cul(tmvs)(hfac)

Bär, E.E.BärLorenz, J.J.LorenzRyssel, H.H.Ryssel2022-03-092022-03-092000https://publica.fraunhofer.de/handle/publica/335184en6706205303D simulation of the conformality of copper layers deposited by low-pressure chemical vapor deposition from cul(tmvs)(hfac)conference paper