Schweigert, U.U.Schweigert2022-03-082022-03-082000https://publica.fraunhofer.de/handle/publica/304587A description is given of a process and a device for assembling electronic components, which are fed individually, on a printed circuit board using a gripper which grips the components by the body and/or leads and inserts the leads of the component into assigned holes on the printed circuit board by means of a traversing movement relative to the printed circuit board. A characteristic feature of the said invention is that a quick-setting adhesive is applied to the base of the component to fix the component in position until soldering is carried out.de608670Verfahren und Vorrichtung zur Montage von elektronischen Bauelementen auf einer LeiterplatteProcess and device for assembling electronic components on a printed circuit boardpatent1989-3914462