Guyenot, V.V.GuyenotRisse, S.S.RisseLude, C.C.Lude2022-03-082022-03-081998https://publica.fraunhofer.de/handle/publica/304058The method involves using an ink, an indian ink, a lacquer or a coloured or blackened adhesive as the opaque film (5). This is applied using a modified ink-jet method whereby droplets are sprayed on contactlessly. The covering film can be applied in drop-on-demand mode. The movement of the ink-jet spray head (6) relative to the microchip is controlled using data directly derived from the layout of the microchip. USE - E.g. for chips with photoelectric functions and other regions with structures sensitive to light. ADVANTAGE - Enables opaque film to be applied at low cost and with little labour.de608620patent1996-19654828