Wolf, M.J.M.J.WolfReichl, H.H.Reichl2022-03-102022-03-102007https://publica.fraunhofer.de/handle/publica/357248After a short introduction to fraunhofer IZM the presentation describes system integration characteristics und challanges. It also point out enabling technologies for systems such as Wafer Level Integration and Board Level Integration. Finally the example of the wireless sensor node will be given.en621conference paper