Stress chip measurements during temperature cycling test

Schindler-Saefkow, FlorianFlorianSchindler-SaefkowRost, F.F.RostOtto, AlexanderAlexanderOttoKeller, J.J.KellerMichel, BerndBerndMichelRzepka, SvenSvenRzepka2022-03-042022-03-042014https://publica.fraunhofer.de/handle/publica/238423enStress chip measurements during temperature cycling testbook article