Schubert, A.A.SchubertDudek, R.R.DudekWalter, H.H.WalterJung, E.E.JungGollhardt, A.A.GollhardtMichel, B.B.Michel2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/339377en621620Lead-free flip-chip solder interconnects - materials mechanics and reliability issuesconference paper