Application of flip-chip bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules

Elger, G.G.ElgerOppermann, H.H.H.H.Oppermann2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/33731010.1109/LEOS.2001.968860en621Application of flip-chip bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modulesconference paper