Abessolo-Bidzo, DolphinDolphinAbessolo-BidzoWeber, JohannesJohannesWeberKiriliouk, VictoriaVictoriaKirilioukWolf, HeinrichHeinrichWolfVerwoerd, SheelaSheelaVerwoerdJirutková, EllenEllenJirutková2022-03-142022-03-142020https://publica.fraunhofer.de/handle/publica/409766This paper studies the CDM stress severity on radiofrequency integrated circuits (RF ICs). The ICs are housed in various IC package sizes and tested with both CDM and CC-TLP test methods. Empirical correlation factors are established based on peak current and energy content driven failure mechanisms of RF pins.enESDCDMCC-TLP621conference paper