Schubert, A.A.SchubertDudek, R.R.DudekVogel, D.D.VogelMichel, B.B.MichelReichl, H.H.Reichl2022-03-032022-03-031997https://publica.fraunhofer.de/handle/publica/190762enfinite element analysisflip-chip devicesplastic deformationreliabilityscanning electron microscopySolderingthermal stress621Materials mechanics and mechanical reliability of flip chip assemblies on organics substratesjournal article