Aschenbrenner, R.R.AschenbrennerAnsorge, F.F.AnsorgeZakel, E.E.ZakelKasulke, P.P.Kasulke2022-03-082022-03-081999https://publica.fraunhofer.de/handle/publica/304370The method involves arranging an electrically conductive coil (2) on the surface of an insulating card (1). One or more non-packaged chips (4) are aligned in openings on the card surface. The electrical connections between the chip contacts and the coil contacts on the card surface are fabricated using flip-chip techniques. The card has openings may be made by injection moulding. The card body may be made of a thermoplastic material such as PVC, ABS or polycarbonate. USE - E.g. for telecommunication and identification, for insurance cards, patient data cards, emergency cards, credit cards or pay TV cards. ADVANTAGE - Provides good mechanical robustness and reliability.de608621patent1997-19732353