Thermal simulation of aluminium nitride heat spreaders for varíous advanced electronic packaging applications

Hahn, R.R.HahnKamp, A.A.KampHoehne, J.J.HoehneTöpfer, M.M.TöpferReichl, H.H.Reichl2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/329143en621Thermal simulation of aluminium nitride heat spreaders for varíous advanced electronic packaging applicationsconference paper