Packaging Technologies in Power Electronic Modules @Fraunhofer IISB

Under CopyrightBayer, Christoph FriedrichChristoph FriedrichBayer2022-03-1428.5.20212021https://publica.fraunhofer.de/handle/publica/41124610.24406/publica-fhg-411246enpackagingPower electronicinterconnection technologiessubstrate technologiespackaging concepts670620530Packaging Technologies in Power Electronic Modules @Fraunhofer IISBpresentation