25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

2024-05-162024-05-162024979-8-3503-9364-4979-8-3503-9363-7https://publica.fraunhofer.de/handle/publica/46793410.1109/EuroSimE60745.2024en25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024