Fischer, U.H.P.U.H.P.FischerPeters, K.K.PetersZiegler, R.R.ZieglerPech, D.D.PechKilk, A.A.KilkMekonnen, G.G.G.G.MekonnenJacumeit, G.G.Jacumeit2022-03-092022-03-091999https://publica.fraunhofer.de/handle/publica/332372We designed and fabricated a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEIC such as diode lasers, semiconductor amplifiers and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature-controlled within an ambient temperature range from -10 degrees C to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less then 3 dB with tapered fibers. The package shows good long-term stability and is well-suited for prototypes and small-scale production.enelectro-optical modulationgallium arsenideindium compoundsintegrated optoelectronicsmoduleoptical couplersoptical fibre communicationoptical receiveroptical transmitterpackagingsemiconductor optical amplifiertapered fiberoptical communication systemsfibre-chip couplingwaveguide-fed oeicInPGaAsdiode lasersemiconductor amplifiersoptical modulatorsimultaneous couplingelectrical modulationrf connectorslong-term stability-10 to 50 degc621conference paper