Ture, ErdinErdinTureCarrubba, V.V.CarrubbaMaroldt, S.S.MaroldtMusser, M.M.MusserWalcher, H.H.WalcherQuay, RüdigerRüdigerQuayAmbacher, OliverOliverAmbacher2022-03-122022-03-122014https://publica.fraunhofer.de/handle/publica/38553910.1109/EuMC.2014.69866792-s2.0-84929240571In this paper a broadband high-efficiency Class- BJ GaN HEMT-PA for wireless communication applications is realized. Influences of packaging and bond wires on the PA performance are investigated in order to demonstrate and use accurate package models. A novel optimization of bond wires for packaged powerbars is therefore performed and, subsequently a fully characterized PA is effectively designed. For the fully assembled PA module, measurement results demonstrated targeted broadband performance reaching approximately 50% operation bandwidth in the frequency range 1.7 - 2.8 GHz with 52 - 59% PAE, 58 - 66% drain efficiency and 43 - 44.5 dBm delivered output power while maintaining over 10 dB of G(T).enbroadband amplifiersclass-JGaN HEMTpackaged powerbarspower amplifiers (PAs)667conference paper