Böttge, B.B.BöttgeNaumann, F.F.NaumannBehrendt, S.S.BehrendtScheibel, M.G.M.G.ScheibelKässner, S.S.KässnerKlengel, S.S.KlengelPetzold, M.M.PetzoldNickel, K.G.K.G.NickelHejtmann, G.G.HejtmannMiric, A.-Z.A.-Z.MiricEisele, R.R.Eisele2022-03-142022-03-142018https://publica.fraunhofer.de/handle/publica/40321510.1109/ECTC.2018.00194The paper introduces novel phosphate cement- and calcium aluminate cement-based material systems with enhanced thermal, mechanical and thermomechanical properties for the encapsulation of power electronic devices and modules. These materials are aiming at improving the high-temperature operation potential of power electronic systems and thus, to promote a successful application of wide bandgap power devices in power electronics. The main focus of the study consists in a thorough material characterization of the novel cement-based encapsulants including high resolution microstructural analysis combined with a modelling approach to support material design optimization. A second task consists in the analysis of interactions of the encapsulants with the electronic material interfaces, e.g. the top-side metallization of power semiconductors, substrate metallizations and bonding wires. Furthermore, power cycling tests coupled with a comprehensive failure analysis have been carried out comparing IGBT power modules with standard silicone gel encapsulation and cement-based encapsulation. The results highlight the potential of the novel cement-based encapsulants on reliability improvements at high-temperature operation.enconference paper