Mechanical stress induced in Si sensors during bonding and packaging processes

Rost, F.F.RostSchindler-Saefkow, FlorianFlorianSchindler-SaefkowSchaufuß, J.J.SchaufußVogel, D.D.VogelMichel, BerndBerndMichelMehner, J.J.MehnerRzepka, SvenSvenRzepka2022-03-132022-03-132015https://publica.fraunhofer.de/handle/publica/395129enMechanical stress induced in Si sensors during bonding and packaging processesconference paper