Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology

Ansorge, F.F.AnsorgeBecker, K.-F.K.-F.BeckerAzdasht, G.G.AzdashtEhrlich, R.R.EhrlichAschenbrenner, R.R.AschenbrennerReichl, H.H.Reichl2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/328960en621Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technologyconference paper