Heinig, AndyAndyHeinigFischbach, RobertRobertFischbachDittrich, MichaelMichaelDittrich2022-03-122022-03-122014https://publica.fraunhofer.de/handle/publica/387101Further improvements in system performance are often limited by the achievable bandwidth between processor and memory. In this paper we look at interposer-based and stacked solutions to integrate processor and memory into a high performance system. The comparison reveals the current advantages of interposer-solutions. This is underlined by thermal and technological considerations. Even though physical design tradeoffs are existent, we show an actual implementation of the chosen technology.en3D integrationinterposerWideIOThermal simulationtechnology comparisonconference paper