Brand, S.S.BrandKögel, M.M.KögelKhaled, A.A.KhaledDeWolf, I.I.DeWolfMoore, M.J.M.J.MooreStrohm, E.M.E.M.StrohmKolios, M.C.M.C.KoliosAltmann, F.F.Altmann2022-03-142022-03-142017https://publica.fraunhofer.de/handle/publica/404201Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.enconference paper