Kretschmann, MariusMariusKretschmannHolc, KatarzynaKatarzynaHolcLeuther, ArnulfArnulfLeutherZwick, ThomasThomasZwick2025-06-132025-06-132025https://publica.fraunhofer.de/handle/publica/48860110.23919/GeMiC64734.2025.10979093A flip-chip bonding process of indium bump interconnects (IBI) is presented in this paper. Test structures manufactured using an InGaAs process are assembled onto laser-structured alumina carrier boards plated with a 2 µm thick gold layer. DC measurements and shear force tests are performed to evaluate the electrical and mechanical quality of the interconnects.enFlip-chip interconnectindium bumplaser-structuringshear force testingconference paper