Production of low cost encapsulation materials on weatherable substrates

Kucukplnar, E.E.KucukplnarKiese, S.S.KieseMiesbauer, O.O.MiesbauerNoller, K.K.NollerAmberg-Schwab, S.S.Amberg-SchwabLohwasser, W.W.LohwasserVacca, P.P.VaccaMacDonald, B.B.MacDonaldMeier, S.S.MeierWiel, B. van derB. van derWielSchilinsky, P.P.Schilinsky2022-03-142022-03-142015https://publica.fraunhofer.de/handle/publica/404173en666664688Production of low cost encapsulation materials on weatherable substratesconference paper