Under CopyrightWacker, C.2022-03-0710.1.20082007https://publica.fraunhofer.de/handle/publica/29348010.24406/publica-fhg-293480Microsystems Technology S.5 IC-Technology S.5 Biotechnical Microsystems S.5 Module Integration S.5-9 TASKS S.10 MANAGEMENT S.10 1 2 3 S.10-32 Preface S.33 Introduction S.33 Technology S.34 Application S.34-35 Introduction S.36 Process S.37 Results S.37-45 Technology approach for nano structures S.46-51 The DAVID project. S.52 Chip-to-Wafer Bonding (C2W) S.53 Electrical Feedthrough in CMOS Circuits: S.53 Selection of a Vacuum Wafer Bonding Technology S.54 Vacuum Lifetime S.54 Definition of Damping Atmosphere S.54 Hermeticy Testing S.55 Common Methods for Leakage Detection S.56 In-line 100% Hermeticity Screen S.56-58 Testboard Layout, S.59 Sample Manufacturing and Verification S.59 FEM-Simulation Conditions S.60 Results of FE-Modelling S.60 Strain Measurements on CSPs Mounted on PCB S.61 Correlation from the View of Analytic Modelling S.62 Temperature Cycles and Crack Length Evaluation S.62-74en621annual report