Alamri, SabriSabriAlamriSchell, FredericFredericSchellSteege, TobiasTobiasSteegeLasagni, Andrés-FabiánAndrés-FabiánLasagniKunze, TimTimKunze2022-03-142022-03-142019https://publica.fraunhofer.de/handle/publica/404912The increasing number of micro-electronic components per unit area led not only to an increase of computing power but also to an increase of the device's operating temperature. Heat sinks, equipped with macroscopic fins or pins, dissipate heat by increasing the surface area. In this work, a microscopic approach for improving the heat transfer of metals is presented, aiming to increase the surface area by fabricating periodical microstructures. Direct Laser Interference Patterning has been used for fabricating microstructures on stainless-steel plates employing a nanosecond IR laser. A statistical design of experiment was used for optimizing the structuring parameters and maximizing the surface area. The heat dissipation properties, evaluated with a heat flux sensor, were correlated with the developed surface area, finding a clear trend. In particular, the microstructuring permitted to increase the surface area up to 280%, which lead to an increase of heat transfer by 23.8%.enheat transfermicrostructureDLIP621671conference paper