Wachmann, EwaldEwaldWachmannSaponara, SergioSergioSaponaraZambelli, C.C.ZambelliTisserand, PierrePierreTisserandCharbonnier, JeanJeanCharbonnierErlbacher, TobiasTobiasErlbacherGrünler, SaeidehSaeidehGrünlerHartler, C.C.HartlerSiegert, J.J.SiegertChassard, P.P.ChassardTon, D.M.D.M.TonFerrari, L.L.FerrariFanucci, L.L.Fanucci2022-03-132022-03-132016https://publica.fraunhofer.de/handle/publica/394581The ATHENIS-3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile Magnetic RAM), circuit-level (inductorless high-voltage DC-DC converter, high-temperature 28nm System-on-Chip platform) and system-level (compact 3D embedded power mechatronic system). Enabling high integration levels of complex systems, operating in harsh environments, in a single packaged 3D device, ATHENIS-3D allows for one order of magnitude area reduction vs. today PCB-based power and control systems. Integration costs will be consequently reduced in key industrial sectors for Europe where high-voltage/temperature operations are mandatory (vehicles, avionics, space/defense, industrial automation, energy). © 2016 EDAA.en3D technologyelectric vehiclesintegrated passive devicespower electronicsSystem-on-chip/in-package (SoC/SiP)Application specific integrated circuitsAutomationChip scale packagesDC power transmissionDC-DC convertersElectric vehiclesMagnetic levitation vehiclesPower electronicsProgrammable logic controllersSystem-on-chipThree-dimensional integrated circuitsVehicles 3D technologyEnabling technologies670620530conference paper