Ribes-Pleguezuelo, P.P.Ribes-PleguezueloZhang, S.S.ZhangBeckert, E.E.BeckertEberhardt, R.R.EberhardtWyrowski, F.F.WyrowskiTünnermann, A.A.Tünnermann2022-03-132022-03-132017https://publica.fraunhofer.de/handle/publica/40157310.1364/LIC.2017.LWA2.42-s2.0-85035095221Mechanico-optical simulations performed with ANSYS and VirtualLab Fusion software to analyze stress-induced birefringence for the packaging of a laser ignition device by a low-stress soldering technique showed almost no influence on the laser output beam.en620Study of a laser packaging technique simulated with ANSYS and virtuallab fusion softwareconference paper