Birckigt, P.P.BirckigtRothhardt, C.C.RothhardtRisse, S.S.RisseZeitner, U.D.U.D.Zeitner2022-05-062022-05-062021https://publica.fraunhofer.de/handle/publica/41720610.1109/LTB-3D53950.2021.9598402Here, we tackle the paradigm that direct bonding of planar wafers is not suitable on non-planar substrates. In doing so, we also present a new method for measuring the interface surface energy. This yields first guidelines for manufacturing novel optical components which combine different optical properties.en620conference paper