Jung, E.E.Jung2022-03-112022-03-112010https://publica.fraunhofer.de/handle/publica/369303Packaging of Microsystems is one of the key technologies for success or failure of a product in the market. Performance aspects, reliability performance, cost and fabrication volume capability are among the factors governed by packaging - if not properly met, even a well designed component will not meet the market requirements. This paper targets to provide an overview on viable technologies for packaging specifically towards the suitability for microsystems with multiple individual components which need to operate seamlessly.en621conference paper