Auersperg, J.J.AuerspergDöring, R.R.DöringDudek, R.R.DudekMichel, B.B.Michel2022-03-092022-03-091998https://publica.fraunhofer.de/handle/publica/330946en621Nonlinear FEA for thermo-mechanical reliability. Estimation of advanced electronic packagesconference paper