Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers

Landesberger, C.C.LandesbergerPaschke, C.C.PaschkeSpöhrle, H.-P.H.-P.SpöhrleBock, K.K.Bock2022-03-042022-03-042014https://publica.fraunhofer.de/handle/publica/2387772-s2.0-84940828631en621Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafersbook article