Heinig, AndyAndyHeinigHopsch, FabianFabianHopsch2023-12-192023-12-192023-01-25https://publica.fraunhofer.de/handle/publica/458199Chiplet packaging depends on heterogeneous integration of multiple chiplets into a single chip. The package must support a variety of devices, based on different process nodes, substrates, and technologies. It must also provide sufficient heat flow to keep the chiplets from going outside normal operating levels. And it must allow for the interconnections and support mechanismus such as interposers needed to create a viable system. Today's advanced packages increase system-level interconnection density, reduce power consumption, integrate more functions, lower cost, and achieve smaller size.enDDC::000 Informatik, Informationswissenschaft, allgemeine Werkepresentation