Tünnermann, A.A.TünnermannEberhardt, R.R.EberhardtKalkowski, G.G.KalkowskiNolte, S.S.Nolte2022-03-082022-03-082007https://publica.fraunhofer.de/handle/publica/308003(A1) Die vorliegende Erfindung betrifft ein Verfahren zum Laser-gestuetzten Bonden von Substraten, bei dem diese zunaechst durch Anpressen kraftschluessig miteinander verbunden werden und im Anschluss durch Laserstrahlung induzierte bereichsweise Aktivierung eine Verfestigung der Verbindung zwischen den Substraten erfolgt. Ebenso betrifft die Erfindung hiernach hergestellte Substrate.DE 102007008540 A1 UPAB: 20080906 NOVELTY - Method for laser-supported bonding of substrates comprises connecting two substrates by indirect contact and strengthening the connection between the substrates by laser-induced activation of the boundary surface between the substrates. The melting and transformation temperatures of the substrates are not exceeded during the activation. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for bonded substrates produced by the above method. USE - Method for laser-supported bonding of substrates. ADVANTAGE - Good adhesion is achieved.de620Verfahren zum Laser-gestuetzten Bonden, derart gebondete Substrate und deren VerwendungMethod for laser-supported bonding of substrates comprises connecting two substrates by indirect contact and strengthening the connection between the substrates by laser-induced activation of the boundary surface between the substratespatent102007008540