Publications Search Results

Now showing 1 - 10 of 43
  • Publication
    Dynamic Bending Reliability Analysis of Flexible Hybrid Integrated Chip-Foil Packages
    ( 2018)
    Palavesam, Nagarajan
    ;
    Yacoub-George, E.
    ;
    Hell, W.
    ;
    Landesberger, C.
    ;
    Kutter, C.
    ;
    Bock, K.
    With the emergence of the Internet-of-Things (IoT) and wearable devices in the recent years, Flexible Hybrid Electronics (FHEs) has attracted significant attention. Chip-foil packages (also known as flexible interposers) fabricated by integrating ultra-thin silicon ICs onto or embedded into polymer foils comprising of metal interconnects (wiring lines, through hole via interconnects etc.) for powering up the system and transmission of data signals / IO commands are ideal candidates for FHE integration. The principal advantages of chip-foil packages over standard Surface Mount Device (SMD) components are their bend ability and conformability. However, the behavior of chip-foil packages under repeated bending must be analyzed in detail through extensive investigations to enable the transfer of the technology from research labs to industrial manufacturing platforms. Hence, we conducted two different types of bending tests to examine the repeated or dynamic bending reliability of the wiring lines and the via interconnects of the chip-foil packages. The experimental results highlight the need for design optimized dimensioning of the wiring lines and the via interconnects for manufacturing FHEs with high performance and good dynamic bending reliability. Such results complement the state-of-the-art information available regarding the electrical as well as mechanical reliability of chip-foil packages and are required as essential information for establishing guidelines for handling chip-foil packages during integration as well as for producing FHEs that are more reliable.
  • Publication
    Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"
    ( 2014)
    Yacoub-George, E.
    ;
    Drost, A.
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    Hemmetzberger, D.
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    Bollmann, D.
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    Faul, R.
    ;
    Bock, K.
  • Publication
    Multifunctional system integration in flexible substrates
    ( 2014)
    Bock, K.
    ;
    Yacoub-George, E.
    ;
    Hell, W.
    ;
    Drost, A.
    ;
    Wolf, H.
    ;
    Bollmann, D.
    ;
    Landesberger, C.
    ;
    Klink, G.
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    Gieser, H.
    ;
    Kutter, C.
    In this paper we present a technology developed for reliable electrical interconnection on film substrates and between vertically stacked film layers. Applying through-hole via technologies for 3D foil stacks enables multi-functionality and RF performance combined with open form-factor and very cost-efficient manufacturing of conformable electronic modules. The manufacture of fine line metal patterns (line /space geometries below 20mm) on film substrates is performed by cost-effective roll-to-roll technology. Furthermore procedures and technologies for handling and lamination of film based sub-modules have been developed. Also the manufacture and handling of ultra-thin and flexible integrated circuits has been combined with placement of SMD type passive and with integrated printed passive components in the same technology.
  • Publication
    Heterointegration technologies for high frequency modules based on film substrates
    ( 2013)
    Bock, K.
    ;
    Yacoub-George, E.
    ;
    Wolf, H.
    ;
    Landesberger, C.
    ;
    Klink, G.
    ;
    Gieser, H.
    System integration technology requires multifunctionality and in many cases energy autarkic systems, very cost-efficient or open form factor solutions. Integration in plastic or foil substrates by a flex-to-flex integration concept shows the potentially free form factor which allows placing of film based systems on curved surfaces or in housings of very low thickness. Such technologies are not limited to flexible applications. They are available for optimized rigid modules and improve the heat sink by thinning and foil handling of transceiver chips or power devices. Thin semiconductor technologies are not limited to silicon, enabling also heterointegration with compound semiconductors. Meanwhile it is possible to integrate high frequency interconnects and printed passives in plastic foil and thin silicon interposer. Possible application scenarios are large area electronics in ceilings panels of cars or mobile communication systems for the "internet of things and humans".
  • Patent
    Sampling module for e.g. supplying breathing air sample of patient to sample analyzer for diagnosing cancer, has sorption element for sorbing component from medium, and desorption element releasing component of medium from sorption element
    ( 2011)
    Strohhöfer, C.
    ;
    Yacoub-George, E.
    ;
    Mohr, G.
    The module (10) has a module body (12) with an interaction volume (16) formed with in an outer wall (14). A sorption element (18a) with a desorption element (20a) e.g. selectively activatable electrical heating element, is provided in the volume. The outer wall comprises two openings through which a sample medium is supplied to the volume. The sorption element is effective for sorbing a component e.g. analytes, from the medium. The desorption element partially releases the sorbed component of the medium from the sorption element. The sorption elements are made of functionalized polymer material, nanotube, microparticle, nanoparticle, nano-porous layer materials, molecular polymers and/or chemical reagents such as crown ether, cyclodextrin, Calixarene and indicator dye, metal organic connections, and biological receptor systems such as antibody, antigens, DNA, RNA, enzymes, enzyme substrates and aptamer. An independent claim is also included for a sample analyzer comprising an analysis port.
  • Patent
    Vorrichtung und Verfahren zum justierten Laminieren von folienbasierten Schaltungsträgern zur Herstellung von flexiblen, mehrlagigen Schaltungssubstraten
    ( 2011)
    Yacoub-George, E.
    ;
    Landesberger, C.
    Bei der Vorrichtung 10 und dem davon ausgeführten Verfahren 100 zur Herstellung eines flexiblen, mehrlagigen Schaltungssubstrats 12 wird eine an einer flexiblen Trägerfolie 32 lösbar anhaftenden ersten Funktionsfolie 70 bereitgestellt, wobei die erste Funktionsfolie 70 ein erstes Funktionselement 72 und eine erste Ausrichtungsmarkierung 74 aufweist. Ferner wird eine auf einem Auflageelement 20 aufliegende zweite Funktionsfolie 80 bereitgestellt, wobei die zweite Funktionsfolie 80 ein zweites Funktionselement 82 und eine zweite Ausrichtungsmarkierung 84 aufweist.; Daraufhin wird die erste und zweiten Funktionsfolie 70, 80 zueinander in eine Ausrichtungsposition gebracht, wobei mittels einer optischen Erfassungseinrichtung 40 anhand der ersten und zweiten Ausrichtungsmarkierung 74, 84 eine Relativbewegung zwischen der ersten und zweiten Funktionsfolie 70, 80 überwacht wird, und wobei die erste und zweite Funktionsfolie 70, 80 in der Ausrichtungsposition ferner eine vorgegebene Beabstandung zueinander aufweisen. Schliesslich wird die erste und zweite Funktionsfolie 70, 80 mittels einer an der ersten oder zweiten Funktionsfolie 70, 80 angebrachten Klebstoffschicht 90 verbunden, indem die flexible Trägerfolie 32 bereichsweise ausgelenkt wird und indem die erste und zweite Funktionsfolie 70, 80 und die dazwischen liegende Klebstoffschicht 90 mittels einer Laminierbewegung bereichsweise Inkontakt gebracht werden.
  • Publication
    Large area multilayer foil assembly for flexible electronic systems
    ( 2011)
    Yacoub-George, E.
    ;
    Ohlander, A.
    ;
    Meixner, L.
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    Bollmann, D.
    ;
    Faul, R.
    ;
    Landesberger, C.
    ;
    Bock, K.
  • Publication
    Self-assembly and self-interconnection of thin RFID devices on plasma-programmed foil substrates
    ( 2010)
    Landesberger, C.
    ;
    Yacoub-George, E.
    ;
    Hell, W.
    ;
    Bock, K.
    The paper reports on a self-assembly process that enables both self-alignment of microelectronic devices and self-interconnection of devices with the surrounding electrical wiring. The complete process was successfully demonstrated using state-of-the-art RFID devices (radio frequency identification device) which were self-connected to four metal pads on polymer foil substrates. The new self-assembly concept comprises the following steps: mask-less plasma patterning process to define target areas for die assembly on polymer tapes, application and self-alignment of a liquid assembly medium at the target area, dropping of the chip device onto the assembly liquid, self-orientation of the chip with respect to the contact pads and finally heat induced bonding and interconnection of the device.
  • Publication
    Development of pH-sensitive indicator dyes for the preparation of micro-patterned optical sensor layers
    ( 2010)
    Trupp, S.
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    Alberti, M.
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    Carofiglio, T.
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    Lubian, E.
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    Lehmann, H.
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    Heuermann, R.
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    Yacoub-George, E.
    ;
    Bock, K.
    ;
    Mohr, G.J.
    Functional hydroxyazobenzene dyes for optically monitoring pH in the range from 610 10 were synthesised The pK(a) values of the dyes have been tailored by appropriate choice of substituents in position para to the hydroxy group, resulting in lower pK(a) values for electron acceptor substituents and higher pK(a) for electron donors Furthermore, substituent effects on absorbance spectra have been evaluated, with expected shifts to longer wavelength in the case of electron donors. For immobilisation, the indicator dyes were covalently linked to cellulose films via vinylsulfonyl chemistry Mechanical stabilization Utile cellulose films was achieved by lamination onto polyethylene terephthalate foils. In order to obtain patterned sensor layers with geometrical defined sensing areas a laser-structured adhesive tape was used as protective mask in the dyeing step.
  • Publication
    Optical sensor layers for amines and pH compatible with reel to reel fabrication technologies
    ( 2010)
    Mohr, G.J.
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    Trupp, S.
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    Alberti, M.
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    Yacoub-George, E.
    ;
    Bock, K.