Publications Search Results

Now showing 1 - 10 of 31
  • Publication
    Evaluating the feasibility of a RISC-V core for real-time applications using a virtual prototype
    ( 2022-02-28) ; ; ; ;
    Fischer, Bernhard
    ;
    Matschnig, Martin
    The replacement of a key component within industrial embedded systems usually requires huge verification and validation efforts. Especially the replacement of the MCU core architecture normally entails significant changes to the HW/SW co-design and co-verification process, possibly including the purchase of costly design and verification IP. Our intended use-case is a system redesign where an established MCU is replaced by a RISC-V core. Since the complete redesign process requires a significant effort, a feasibility evaluation study helps to elaborate the system requirements and to detect possible issues early in the replacement process. Once feasibility has been demonstrated, hardware (re-)design may start. In this paper we propose a HW/SW co-verification methodology to evaluate the feasibility of an MCU core replacement based on a virtual prototype, thereby saving time and cost for the redesign process. This methodology links the VP development process with the requirements management process to re-use the test cases.
  • Patent
    Concept of coupled electrothermal simulation
    Die vorliegende Erfindung bezieht sich auf eine Vorrichtung zum Erstellen einer thermischen Ersatzschaltung eines physikalischen Aufbaus, bei der die Vorrichtung ausgelegt ist, um thermische Admittanzmatrizen basierend auf einer Modellierung eines physikalischen Aufbaus für eine Mehrzahl von Frequenzen zu bestimmen; und wobei die Vorrichtung ausgelegt ist, um eine thermische Ersatzschaltung basierend auf den thermischen Admittanzmatrizen für die Mehrzahl von Frequenzen zu bestimmen.
  • Publication
    Towards a Standardized Format for Automotive Mission Profiles
    ( 2021) ;
    Fischbach, Robert
    ;
    Krinke, Andreas
    ;
    Nirmaier, Thomas
    ;
    Meyer zu Bexten, Volker
    ;
    Jerke, Göran
    ;
    Novacek, Jan
    Mission profiles are fundamental to technology development, product robustness validation and reliability engineering in the automotive development process. They contain a simplified, quantitative representation of external and internal load conditions which a component or system is exposed to during its production and operation. One of the main purpose of mission profiles is the exchange of information between different partners along the automotive supply chain, for instance quantitative requirements or qualification results. Clear and unambiguous communication between the development partners is of key importance for developing reliable and robust electronic and electro-mechanical products. However, until today there exists no standardized electronic data format for mission profiles that enables such unambiguous communication along the supply chain. We present currently ongoing efforts to define and specify the XML format MPFO aiming for international standardization.
  • Publication
    Automated traceability of requirements in the design and verification process of safety-critical mixed-signal systems
    System-level design and verification of safety-critical hardware requires a consistent methodology which complies with industrial safety-standards, for example ISO 26262 for automotive applications. For certification of safety-critical systems, the development process has to implement and enforce a strict traceability of requirements, linking the requirement specification, the design implementation, and the verification testbench and results. This is particularly challenging in the AMS domain since it spans multiple engineering and tool environments. No standardized industrial solution is available for this task. In this work we propose an industry-compatible tool flow for an automated implementation of test cases from system-level requirements including traceability of the verification flow. This automated tool flow accelerates the design and verification process of safety-critical systems while making it robust against human error. The workflow is demonstrated in the design and verification of an AMS block of an automotive SoC, a 12-bit 4-stage pipelined ADC.
  • Publication
    Virtual Prototyping In SoC Development
    Investment into a model-driven development approach is needed to speed up the development process. Modern semiconductor technologies enable manufacturers to pack more and more functions and memory into a single silicon die. While steadily advancing microintegration based on Moore's Law just a few years ago mainly focused on increasing the clock frequency of integrated circuits (IC), today, it's the design complexity and number of blocks that enable new IC functions. More and more logic blocks, processor cores, accelerators, and memory - in what is referred to as a system on a chip (SoC) - allow embedded systems to do more than what may have seemed possible not too long ago.
  • Publication
    Dynamic fault injection into digital twins of safety-critical systems
    In this work we present a technology for dynamically introducing fault structures into digital twins without the need to change the virtual prototype model. The injection is done at the beginning of a simulation by dynamically rewiring the involved netlists. During the simulation on a real-time platform, faults can be activated or deactivated triggered by sequences, statistical effects or by events from the real world. In some cases the fault structures can even be auto-generated directly from a formal specification, which further automates the development process for safety-relevant systems. The approach is demonstrated at a SystemC/ SystemC AMS virtual prototype of a safety-critical sub-systems which runs on a dSPACE real-time hardware.
  • Publication
    How Virtual Prototyping Benefits the Development of Embedded Systems
    Embedded systems combine highly complex integrated electronics with similarly complex software in order to control the world around us. Much of our daily life relies on the faultless operation of those systems. The increasing demand for functionality, performance, and energy efficiency is a huge challenge for HW/SW codesign. Virtual prototypes and efficient system-level models can help to solve some of the challenges in design and verification of embedded electronics.
  • Publication
    Model-Based Systems Design for Green IoT Systems
    The energy consumption of the Internet of Things is predicted to be about a quarter of the total world-wide energy consumption by 2030. There are already numerous approaches and operating strategies to reduce the energy consumption of wireless sensors. Nevertheless, it is essential to implement a formalized model-based development process that enables the designer of IoT nodes, platforms and systems to balance between the function and non-functional requirements with respect to energy consumption. Therefore we promote a model-based systems design methodology that employs multi-physical co-simulation in a virtual simulation environment in order to optimize the overall energy consumption.
  • Publication
    Multiple current filaments and filament confinement in silicon based PIN diodes
    ( 2021)
    Scharf, Patrick
    ;
    Electrostatic discharge (ESD) is one of the greatest reliability risks for modern electronics. Failures occur due to a high current injection. One of the dominant failure mechanisms during an ESD event is thermal runaway caused by an avalanche breakdown leading to an inhomogeneous current flow and a current filament. Investigations on the formation and motion of current filaments were carried out with the help of special test structures of silicon based PIN diodes using technology computer-aided design (TCAD) simulations and transmission line pulse (TLP) measurements. In thin structures the current filament gets constricted (filament confinement), which can lead to the formation of multiple current filaments.
  • Publication
    Entwicklung eines Standards für ein elektronisches Datenformat zur Beschreibung von Mission Profiles
    Ein Mission Profile (MP) ist eine vereinfachte Darstellung aller relevanten statischen und dynamischen Lastbedingungen und Lastprofile, welchen eine Population von elektrischen, elektronischen und elektromechanischen Komponenten innerhalb ihres gesamten Lebenszyklus ausgesetzt ist. Ziel des WIPANO-Projektvorhabens ELDA-MP ist es, auf Basis des XML-basierten Datenformats MPFO einen Standardisierungsvorschlag für ein elektronisches Datenformat für Mission Profiles zu erarbeiten, abzustimmen und zu dokumentieren sowie zur nationalen und internationalen Standardisierung einzureichen. Das Poster präsentiert die Grundlagen des Datenformats.