Filters

76
58 18
Reset filters

Settings
Author: Klumpp, A. ×

Publications Search Results

Now showing 1 - 10 of 76
  • Publication
    Towards low cost and low temperature capacitive CO2 sensors based on amine functionalized silica nanoparticles
    ( 2019)
    Boudaden, J.
    ;
    Klumpp, A.
    ;
    Endres, H.-E.
    ;
    Eisele, I.
    Hybrid materials based on inorganic particles and an organic polymer were developed and used as an efficient sensing material for carbon dioxide (CO2). The sensing material consists of fumed silica that is functionalized with an organic polymer, polyethylenimine, by means of the impregnation method. The organic polymer is effectively immobilized around the silica nanoparticles and confirmed by infrared spectroscopy. Thermogravimetric analysis proves the thermal stability of the sensing material. CO2 capacitive sensors operating at temperatures lower than 70 °C were fabricated by depositing a thin layer of hybrid sensing material on interdigitated gold electrodes. Impedance spectroscopy explored the sensing capability of the hybrid organic-inorganic material towards CO2 in the presence of different relative humidity levels, as well as its stability and reversibility. This strategy to couple organic and inorganic materials as a sensing layer for CO2 paves the way for the design of a low-cost CO2 sensor.
  • Publication
    A CMOS-Based Electrochemical DNA Hybridization Microarray for Diagnostic Applications with 109 Test Sites
    ( 2019)
    Dodel, N.
    ;
    Laifi, A.
    ;
    Eberhardt, D.
    ;
    Keil, S.
    ;
    Sturm, L.
    ;
    Klumpp, A.
    ;
    Freudenberg, O.
    ;
    Gerfers, F.
    ;
    Hartwich, G.
    ;
    Thewes, R.
    A 3 × 6 mm 2 CMOS DNA hybridization microarray chip is presented with 109 test sites. DNA hybridization is revealed by a decreasing cyclic voltammetry response at the respective test sites following the displacement of DNA signal oligo strands in case of successful matching and binding between PCR product and signal oligos. Each test site is equipped with a first order sigma-delta modulator providing an SNDR of 40 dB within a full scale range of +/- 16 nA. The entire chip is equipped with a user-friendly SPI Interface. Experiments with biological content demonstrate proper functionality.
  • Publication
    Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism
    ( 2017)
    Siris, R.
    ;
    Boudaden, J.
    ;
    Klumpp, A.
    TiO2-nanoparticles under UV-light irradiation are well known for photocatalytic activities due to generated electron/hole pairs. This is investigated for widespread applications like water splitting for fuel generation, wetting of surfaces, photovoltaics or destruction of germs and bacteria on contaminated surfaces. TiO2 nanoparticles combined with copper and palladium nanoparticles show selective reactions with nitrate ions in water in the presence of hydrogen. We investigated the possibility to use this catalytic reaction of Cu/Pd@TiO2 without supplying hydrogen. The supply of needed electrons to copper oxide reduction is enabled by UV-excited TiO2-nanoparticles. The newly designed material combination based only on inorganic materials gives the chance of a stable sensor system that needs no specific storage conditions enabling easy field of application usage. The results demonstrate the ability of our sensor concept to detect the requested concentration of nitrate in drinking water defined by the European Commission.
  • Publication
    Smart HVAC sensors for smart energy
    ( 2017)
    Boudaden, J.
    ;
    Wenninger, F.
    ;
    Klumpp, A.
    ;
    Eisele, I.
    ;
    Kutter, C.
    The main task of our work is to realize an integrated temperature, CO2, relative humidity RH detection system, which is designed to function within a HVAC system. If the CO2 concentration exceeds e.g. 1000 ppm, the sensor produces a signal to the ventilation system to supply fresh air until reaching a comfortable atmosphere for occupants.
  • Publication
    3D TSV based high frequency components for RF IC and RF MEMS applications
    ( 2016)
    Fernandez-Bolanos, M.
    ;
    Vitale, W.A.
    ;
    López, M.M.
    ;
    Ionescu, A.M.
    ;
    Klumpp, A.
    ;
    Merkel, R.
    ;
    Weber, J.
    ;
    Ramm, P.
    ;
    Ocket, I.
    ;
    Raedt, W. de
    ;
    Enayati, A.
    We demonstrate and review the unique fine-pitch high-aspect ratio tungsten-filled through-silicon vias (W-TSVs) technology developed by Fraunhofer EMFT in high-resitivity silicon substrates. The proposed process flow is fully compatible with both CMOS and MEMS technology, allowing 3D heterogeneous integration of highperformance, low power, compact tunable RF front-ends. We have assessed the figures of merit of the technology for RF functionality by fabricating and characterizing different configurations for CPWs with TSV transitions, mm-wave antennas and LC resonators as well as record-high performance wideband out-of-plane micro-inductors.
  • Publication
    Ultra fine-pitch TSV technology for ultra-dense high-Q RF inductors
    ( 2015)
    Vitale, W.A.
    ;
    Fernandez-Bolanos, M.
    ;
    Klumpp, A.
    ;
    Weber, J.
    ;
    Ramm, P.
    ;
    Ionescu, A.M.
    We demonstrate that fine-pitch TSV technology can be exploited to fabricate micro-inductors on high resistivity substrate, with record-high inductance per area and preserving their performance at GHz frequencies. We report an extensive experimental study on the effects of dimensional scaling and passive device density on RF performance of out-of-plane inductors exploiting W-based TSVs, with pitches down to 10 mm. We show wideband RF inductors with an unprecedented combination of a quality factor peak of 7.8 at 13 GHz, self-resonance frequency of 29.2 GHz, and inductance density of 124.4 nH/mm2. The reported technology also includes low loss interconnects, fixed capacitors and LC tanks, design to serving high performance 3D-integrated RF functionalities.
  • Publication
    Low-temperature bonding technologies for MEMS and 3D-IC
    ( 2014)
    Taklo, M.M.V.
    ;
    Schjolberg-Henriksen, K.
    ;
    Malik, N.
    ;
    Tofteberg, H.R.
    ;
    Poppe, E.
    ;
    Vella, D.O.
    ;
    Borg, J.
    ;
    Attard, A.
    ;
    Hajdarevic, Z.
    ;
    Klumpp, A.
    ;
    Ramm, P.
    Recent developments within MEMS and IC call for a reduction in bonding temperature down to 350 °C and below. For MEMS, sensitive mechanical structures, thinned wafers, and heterogeneous integration of temperature-sensitive materials or materials with dissimilar temperature responses are main driving forces. For 3D-ICs, transistors' sensitivity to stress, and stress-induced failures in fragile dielectric layers are important motivations. The ongoing research on low-temperature bonding in the fields of MEMS and 3D-IC integration are partly overlapping. Therefore, extended knowledge exchange can be of mutual benefit, and will be attempted in this invited talk.
  • Publication
    Heterogene Systemintegration von Halbleitersensoren
    ( 2012)
    Klumpp, A.
    ;
    Nebrich, L.
    ;
    Eisele, I.