Publications Search Results

Now showing 1 - 10 of 63
  • Publication
    Intelligente Steckverbinder und Anschlusstechnologien für die Produktion der Zukunft
    ( 2015)
    Michels, J.S.
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    Mödinger, R.
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    Meier, O.
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    Baar, C.
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    Ansorge, F.
    ;
    Schiefelbein, F.-P.
  • Publication
    Hochstromkontakte für Smart-Power Mechanics
    ( 2015)
    Ansorge, F.
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    Ratke, H.
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    Schreier-Alt, T.
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    Baar, C.
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    Ifland, D.
    ;
    Lang, K.-D.
  • Publication
    Smart Power Mechanics - Elektrische Anschlusstechnologien für Morgen
    ( 2015)
    Schreier-Alt, T.
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    Ansorge, F.
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    Baar, C.
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    Radtke, H.
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    Amende, T.
    Dieser Artikel stellt den Forschungsschwerpunkt ""Smart Power Mechanics"" am Standort Oberpfaffenhofen des Fraunhofer IZM beispielhaft an Aluminiumschraubverbindungen dar, wie sie beim Anschluss von Massekabeln an die Aluminiumkarosserie moderner Leichtbaufahrzeuge eingesetzt werden. Es wird der Bogen gespannt von den theoretischen Grundlagen über die Korrelation von Experimenten und numerischer Simulation bis hin zur Überführung der Erkenntnisse in die industrielle Praxis.
  • Publication
    Prozessoptimierung und Produktprüfung von QFN-Bauteilen mit dem iForce-Stressmesschip
    ( 2014)
    Schreier-Alt, T.
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    Ansorge, F.
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    Chmiel, G.
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    Lang, K.-D.
  • Publication
    Next Generation Substrates - wie elektronische Systeme maskenlos gedruckt werden
    ( 2014)
    Ansorge, F.
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    Ifland, D.
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    Baar, C.
    ;
    Lang, K.-D.
  • Publication
    Raffungsmodelle für die Qualifikation von Einpresskontakten für Leiterplatten
    ( 2014)
    Schreier-Alt, T.
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    Heimerle, D.
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    Ring, K.
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    Möhler, A.
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    Baar, C.
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    Ansorge, F.
  • Publication
    Generative Fertigungstechnologien für eine Direktintegration von mikroelektronischen Komponenten und Kontaktstrukturen
    ( 2013)
    Ifland, D.
    ;
    Ansorge, F.
    ;
    Baar, C.
    ;
    Lang, K.-D.
    The present article deals with the development ofSys-tem-in-Package (SiP) modules, which are produced by stereolithography, an additive fabrication process. During the production process of the SIP module the necessary electrical components will be integrated into the carrier substrate. Afterwards the components will be interconnected of an electrically conductive adhesive. This method is intended to demonstrate a novel three-dimensional construction and connection technology for microsystems.
  • Publication
    Löten ade - elektronische Systeme aus dem Drucker?
    ( 2013)
    Ansorge, F.
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    Ifland, D.
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    Baar, C.
    ;
    Lang, K.-D.
  • Publication
    Piezoresistive stress sensor for inline monitoring during assembly and packaging of QFN
    ( 2013)
    Schreier-Alt, T.
    ;
    Chmiel, G.
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    Ansorge, F.
    ;
    Lang, K.-D.
    This paper presents stress measurements in leadframe based QFN components due to fabrication and assembly processes, characterized by substitution with stress measurement chips. The results are based on a method to determine stresses within electronic components by use of on-chip CMOS stress measurement technology, realized during the BMBF funded project iForceSens. All relevant production steps have been investigated. Four different chip and package sizes have been studied. Typical stress states will be compared with warpage and delamination analysis. The stress sensor is based on a CMOS chip. Although it is subdivided into 60 measurement cells (300 m grid) the sensor needs only four electrical connections. This alignment allows the determination of the stress distribution on the surface of the whole silicon chip. We are able to measure the shear and both main stresses in-plane of the chip surface with a resolution of < 10 MPa. The stress value of the measurement cell can be interrogated subsequently within 16 ms time steps. We used the main potential of this stress measurement chip by replacing the original electronic chip and investigating all production related loads acting on leadframe based QFN products. With the stress measurement chip we investigated wafer thinning as well as typical packaging processes like transfer molding. The measurement of stresses during soldering of QFN parts on printed circuit boards stretches the view towards the consumer product. We investigated application driven questions like the thickness of QFN packages and whether the QFN or chip size determines stresses inside the component.
  • Publication
    3-dimensionaler Druck für kostengünstige Individualisierung im Mikro- und Nanobereich
    ( 2011)
    Ansorge, F.
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    Ifland, D.
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    Baar, C.
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    Heumann, K.
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    Stigler, T.
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    Lang, K.D.