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Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices 1998. Proceedings
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Title
Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices 1998. Proceedings
Verlag
ASME
Verlagsort
New York
Datum
1998
Serie
EEP; 25
Konferenz
Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices 1998
