Title

25th European Microelectronics and Packaging Conference & Exhibition, EMPC 2025. Proceedings

Title Supplement
September 16 - 18, 2025, World Trade Center, Grenoble, France
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-  
International Microelectronics and Packaging Society -IMAPS-  
IEEE Electronics Packaging Society  
Publisher
Publication Date
2025
ISBN
979-8-3315-6575-6
978-1-7395005-1-1
DOI
Conference
Acronym
EMPC
Language
English