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  4. Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"
 
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2014
  • Konferenzbeitrag

Titel

Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"

Author(s)
Yacoub-George, E.
Drost, A.
Hemmetzberger, D.
Bollmann, D.
Faul, R.
Bock, K.
Hauptwerk
Smart Systems Integration 2014
Konferenz
Smart Systems Integration Conference (SSI) 2014
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2014
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Language
Englisch
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