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Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging
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2019
Conference Paper
Titel
Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging
Author(s)
Froehlich, A.
Hofmann, Christian
Rochala, P.
Kimme, J.
Kroll, M.
Kraeusel, V.
Hauptwerk
HES-19, International Conference on Heating by Electromagnetic Sources
Konferenz
International Conference on Heating by Electromagnetic Sources (HES) 2019
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS