2014
Presentation
Title

3D technology as a holistic approach - quo vadis?

Title Supplement
Presentation held at European 3D TSV Summit, Grenoble, France, 21.01.-22.01.2014
Abstract
The presentation gives an overview about the key enabling technologies for 3D system integration, describes in details the holistic approach and the competencies of the Fraunhofer Cluster 3D Integration in the areas design, technology, analytic, simulation and reliablity.
Author(s)
Wolf, M. Jürgen
Schneider, Peter  
Schulz, Stefan  
Zschech, Ehrenfried
Conference
File(s)
Rights
Use according to copyright law
DOI
Language
English