Robust 3D radio sensor systems with embedded active and passive components for industrial applications
Abstract
Future miniaturized wireless sensor nodes will increasingly support the coordination of production processes and provide substantial cost savings as part of condition-based maintenance. Production processes can be made much more flexible. A modular assembly concept has been developed for industrial environments. Module integration technologies for embedding electronic components into the substrate offer particular advantages for the design of small wireless sensor systems. However, several challenges arise during the module layout. An example of industrial sensors for condition monitoring illustrates how to implement fully functional prototypes.
