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  4. A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
 
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2010
  • Konferenzbeitrag

Titel

A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links

Abstract
For the first time we present a small form-factor, low-cost package that is suitable for transmitter optical subassemblies (TOSAs) and receiver optical subassemblies (ROSAs) with serial speeds up to 40 Gbit/s. The TOSA includes a very high speed vertical cavity surface emitting laser (VCSEL) and a driver integrated circuit (IC) inside the package and the ROSA combines a high speed photodiode (PD) with a transimpedance amplifier (TIA) IC. The overall housing concept is based on a TO-can (Transistor Outline) packaging technology in order to realize a hermetically-sealed, high volume and low cost prototype product solution. The radial dimensions of the TOSA/ROSA package are selected to fit easily within standard optical transceiver form-factors for example SFP and QSFP (quad small form-factor pluggable).
Author(s)
Kropp, J.R.
Lott, J.A.
Ledentsov, N.N.
Otruba, P.
Drögemüller, K.
Fiol, G.
Bimberg, D.
Ndip, I.
Erxleben, R.
Maaß, U.
Klein, M.
Lang, G.
Oppermann, H.
Schröder, H.
Reichl, H.
Hauptwerk
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2
Konferenz
Electronics System Integration Technology Conference (ESTC) 2010
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DOI
10.1109/ESTC.2010.5642895
Language
Englisch
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