Experimental characterization methods for power MOSFET assemblies
Abstract
In this paper, experimental methods to characterize the electrical and thermal package properties of newly developed MOSFET technology demonstrators are discussed. The electrical measurements focus on the switching characteristics and the stray inductance. From the thermal point of view, the steady-state temperature distribution within the package is measured. Exemplarily, measurement results for the FlipChip on Flex technology applying low-voltage, high current MOSFETs are used for the evaluation.
