Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies
Miniaturized wireless sensors are mostly easier to integrate into everyday objects and show very high mechanical robustness. The development of these embedded micro systems has to consider the interdependence of design decisions regarding network communication, wireless sensor hardware and fabrication technology. Starting from the functional analysis, the local hardware architecture is selected according to the required com-ponent dimensions. A cycle-accurate simulator was implemented to better predict volume shares. Afterwards, the potential miniaturization degree is derived according to different 3D packaging technologies. The results are verified by prototype implement-tations based on different 3D integration technology platforms.